The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Dec. 01, 2015
Applicant:

Valeo Equipements Electriques Moteur, Creteil, FR;

Inventors:

Arnaud Soisson, Neuville-sur-Oise, FR;

Philippe Banet, Acheres, FR;

Linda Chikh, Maisons-Laffitte, FR;

Odile Fichet, Poissy, FR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/296 (2013.01); H01L 23/295 (2013.01); H01L 2224/48137 (2013.01);
Abstract

In order to carry out the encapsulation of electronic components, the invention proposes to cover the electronic components () with a heat-polymerisable material corresponding to a composition comprising a diimide constituent and a diamine constituent, in which the diimide constituent has been predissolved in the diamine constituent, and to heat the assembly obtained under conditions suitable for carrying out the curing of the material by an addition polymerization reaction between said diimide constituent and the diamine constituent. The invention finds an application in particular in the field of electronic power modules.


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