Neerijse, Belgium

Arjen Klaver

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Asm IP Holding B.v.. Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Arjen Klaver. Retrieved from https://idiyas.com/inventor/arjen-klaver-xqvsk6cb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023-2026

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2 patents (USPTO):Explore Patents

Title: Arjen Klaver: Innovator in Layer Forming Technology

Introduction

Arjen Klaver is a notable inventor based in Neerijse, Belgium. He has made significant contributions to the field of layer forming technology. His innovative approach has led to the development of a unique method and apparatus for forming layers on substrates.

Latest Patents

Arjen Klaver holds 1 patent for his invention titled "Layer forming method and apparatus." This patent describes a method for forming a layer by sequentially repeating a layer deposition cycle to process a substrate disposed in a reaction chamber. The deposition cycle is designed to enhance the efficiency and effectiveness of layer formation.

Career Highlights

Throughout his career, Arjen Klaver has been associated with Asm IP Holding B.V., where he has applied his expertise in layer deposition technologies. His work has been instrumental in advancing the capabilities of substrate processing.

Collaborations

Arjen has collaborated with several talented individuals in his field, including Werner Knaepen and Lucian C Jdira. These collaborations have fostered innovation and have contributed to the success of his projects.

Conclusion

Arjen Klaver's contributions to layer forming technology exemplify the spirit of innovation in the field. His patent and collaborative efforts highlight his commitment to advancing technology in substrate processing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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