Company Filing History:
Years Active: 2003-2015
Title: Aris Bernales: Innovator in MEMS Technology
Introduction
Aris Bernales is a notable inventor based in Santa Clara, CA, who has made significant contributions to the field of Micro-Electro-Mechanical Systems (MEMS). With a total of 2 patents, his work focuses on advanced manufacturing methods and interposer technologies that enhance the performance of integrated circuits.
Latest Patents
One of his latest patents is a MEMS device chip manufacturing method. This innovative method includes a grinding step that forms a recess and an annular reinforcing portion on a wafer. Following this, a MEMS device forming step is performed, which involves etching the wafer to create multiple MEMS devices partitioned by crossing division lines. Finally, the wafer is divided along these lines to produce several MEMS device chips.
Another significant patent is for a composite interposer and the method for producing it. This interposer provides power and signal connections between integrated circuit chips and substrates. It features a signal core made from a conductive power/ground plane situated between two dielectric layers. The fabrication method involves disposing a silicon layer on a substrate, selectively etching it, and forming vias filled with a high-aspect-ratio-capable photodefinable epoxy polymer.
Career Highlights
Throughout his career, Aris has worked with prominent companies such as Fujitsu Corporation and Disco Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in MEMS technology.
Collaborations
Aris has collaborated with talented individuals in the field, including Michael G. Peters and Mark Thomas McCormack. These partnerships have contributed to the advancement of his projects and the successful development of his patents.
Conclusion
Aris Bernales stands out as a key figure in MEMS technology, with his patents reflecting his innovative spirit and technical expertise. His contributions continue to influence the industry and pave the way for future advancements.