Pine Plains, NY, United States of America

Anthony Wayne Sigler


Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2004-2005

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2 patents (USPTO):

Title: Innovations of Anthony Wayne Sigler

Introduction

Anthony Wayne Sigler is a notable inventor based in Pine Plains, NY (US). He has made significant contributions to the field of technology, particularly in the area of chip carrier modules. With a total of 2 patents, his work showcases his innovative approach to solving complex engineering problems.

Latest Patents

One of his latest patents is titled "Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules." This invention discloses a jogging structure designed to translate wiring connections from points in a first grid to corresponding points in a second grid within a chip carrier module. In an exemplary embodiment, the structure includes a first translation layer that is coupled to the first grid, translating the first grid in an x-axis direction. Additionally, a second translation layer is coupled to the first translation layer, which translates the wiring connections from the first grid in a y-axis direction, orthogonal to the x-axis direction. The second translation layer is further coupled to the second grid, enhancing the efficiency of wiring translation in chip carrier modules.

Career Highlights

Anthony Wayne Sigler is currently employed at International Business Machines Corporation, commonly known as IBM. His role at IBM allows him to work on cutting-edge technologies and contribute to the advancement of the industry.

Collaborations

Throughout his career, Sigler has collaborated with talented individuals such as Glenn Graham Daves and Jason Lee Frankel. These collaborations have likely enriched his work and led to innovative solutions in his field.

Conclusion

Anthony Wayne Sigler's contributions to technology, particularly through his patents, highlight his innovative spirit and dedication to engineering excellence. His work continues to influence the development of chip carrier modules and related technologies.

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