Annie Tan

Title: Innovations by Annie Tan in Chip Laminate Packaging

Introduction

Annie Tan is a prominent inventor based in Singapore, known for her contributions to the field of chip laminate packaging. With a focus on enhancing the durability and efficiency of packaging methods, she has made significant strides in the industry. Her innovative approach has led to the development of a patented technology that addresses common challenges faced in chip laminate packaging.

Latest Patents

Annie Tan holds a patent for an "Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages." This invention provides a solution for creating delamination-resistant chip laminate packages, allowing for the use of larger chip array block sizes. The advanced mold die designed by Tan features multiple wells for forming ejector pin tabs that are integrally connected to the mold cap. This design ensures that ejector pins bear against the pin tabs during the release process, significantly reducing the risk of delamination and enhancing the moisture sensitivity of the packages.

Career Highlights

Annie Tan is currently employed at Cypress Semiconductor Corporation, where she continues to innovate and develop new technologies in the semiconductor industry. Her work has not only contributed to her company's success but has also advanced the field of chip packaging as a whole.

Collaborations

Throughout her career, Annie has collaborated with talented professionals, including Vani Verma and Bo Soon Chang. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Annie Tan's innovative contributions to chip laminate packaging demonstrate her commitment to advancing technology in the semiconductor industry. Her patented methods and collaborative spirit continue to inspire progress and innovation in her field.