Company Filing History:
Years Active: 2019-2021
Title: Innovations by Angus Hsiao in Semiconductor Fabrication
Introduction
Angus Hsiao is a notable inventor based in Changhua County, Taiwan. He has made significant contributions to the field of semiconductor device fabrication, holding a total of 3 patents. His work focuses on innovative methods that enhance the efficiency and effectiveness of semiconductor manufacturing processes.
Latest Patents
Among his latest patents, Angus Hsiao has developed a method of semiconductor device fabrication. This method includes several key steps: forming a dielectric layer over a substrate, creating a hard mask (HM) layer over the dielectric layer, and forming a fin trench that extends down to the substrate. Additionally, he has designed a process for forming a semiconductor feature within the fin trench and removing the HM layer to expose an upper portion of the semiconductor feature, ultimately creating fin features.
Career Highlights
Angus Hsiao is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approaches have contributed to advancements in semiconductor technology, making him a valuable asset to his company.
Collaborations
Angus collaborates with Tsung-Yao Wen, a fellow professional in the semiconductor field. Their partnership exemplifies the importance of teamwork in driving innovation and achieving breakthroughs in technology.
Conclusion
Angus Hsiao's contributions to semiconductor device fabrication highlight his role as a key inventor in the industry. His innovative methods and collaborative efforts continue to push the boundaries of technology, paving the way for future advancements in semiconductor manufacturing.