Angela Rogona

Title: Angela Rogona: Innovator in Semiconductor Technology

Introduction

Angela Rogona is a prominent inventor based in Phoenix, AZ. She has made significant contributions to the field of semiconductor technology. Her innovative work has led to the development of a unique backside metallization scheme for semiconductor devices.

Latest Patents

Angela holds a patent for a "Backside metallization scheme for semiconductor devices." This patent describes a process that includes a vanadium layer disposed on the backside of a wafer and a silver layer on top of the vanadium layer. An optional intermediate layer, which may consist of a mixture of vanadium and silver or nickel, can be placed between the two layers. The vanadium layer is known for its excellent adhesion characteristics, while the silver layer provides outstanding solderability.

Career Highlights

Angela is currently employed at Motorola Corporation, where she continues to push the boundaries of semiconductor technology. Her work has been instrumental in enhancing the performance and reliability of semiconductor devices.

Collaborations

Angela has collaborated with notable colleagues, including Ravinder K Sharma and William H Lytle. These partnerships have fostered innovation and contributed to the advancement of their projects.

Conclusion

Angela Rogona's contributions to semiconductor technology exemplify her dedication and expertise in the field. Her innovative patent and work at Motorola Corporation highlight her role as a leading inventor in the industry.