Angel Orabuena Alvarez

Title: Innovations by Angel Orabuena Alvarez

Introduction

Angel Orabuena Alvarez is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on developing innovative semiconductor packages that enhance performance and efficiency.

Latest Patents

One of his latest patents is the "Near chip size semiconductor package." This invention allows for a semiconductor package that can accommodate chips of various sizes without altering the footprint of the carrier package. The design includes a leadframe, a semiconductor chip attached to the leadframe, electrical connectors, and a sealing material. The leadframe features multiple leads, each with an upper side, a lower exposed side, and a laterally exposed side, ensuring a co-planar surface for optimal functionality.

Another significant patent is the "Stackable semiconductor package and method for manufacturing same." This innovation involves leadframe-type semiconductor packages that can be stacked vertically. The design includes a leadframe, electrical connectors, a semiconductor chip, and a sealing material. The leads run from the top to the bottom of the package, allowing for electrical connections between stacked packages. This design also facilitates improved heat dissipation through the space created by the protruding leads.

Career Highlights

Angel Orabuena Alvarez is currently employed at Amkor Technology, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packaging, making significant impacts in the industry.

Collaborations

Throughout his career, Angel has collaborated with talented individuals such as Sean Timothy Crowley and Jun Young Yang. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Angel Orabuena Alvarez is a prominent figure in the semiconductor industry, known for his innovative patents and contributions to technology. His work at Amkor Technology, Inc. continues to influence the future of semiconductor packaging.