This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: The Innovations of Andrew Yeohi
Introduction
Andrew Yeohi is an accomplished inventor based in Portland, Oregon. He is known for his contributions to the field of microelectronics, particularly through his innovative patent. His work has significant implications for the development of advanced electronic devices.
Latest Patents
Andrew Yeohi holds a patent titled "Methods of forming stepped bumps and structures formed thereby." This patent describes methods for forming a microelectronic device and associated structures. The methods involve creating a die-side conductive interconnect on a substrate, which includes a columnar portion and a base portion. Notably, the diameter of the base portion is greater than that of the columnar portion. This innovation enhances the performance and reliability of microelectronic devices.
Career Highlights
Yeohi is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His role at Intel allows him to work on cutting-edge technologies that shape the future of electronics. With 1 patent to his name, he has made a notable impact in his field.
Collaborations
Throughout his career, Andrew has collaborated with talented individuals such as Guotao Wang and Sairam Agraharam. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Andrew Yeohi's contributions to microelectronics through his patent and work at Intel Corporation highlight his role as a significant inventor in the industry. His innovative methods for forming microelectronic devices pave the way for future advancements in technology.