Andrew Pomerene

Title: Innovations of Andrew Pomerene

Introduction

Andrew Pomerene is an accomplished inventor based in Albuquerque, NM (US). He has made significant contributions to the field of technology, particularly in the development of advanced photodetectors and integrated circuits. With a total of two patents to his name, Pomerene's work showcases his expertise and innovative spirit.

Latest Patents

Pomerene's latest patents include a method of fabricating photosensitive devices with a reduced process-temperature budget. This method involves fabricating a backside-illuminated photodetector by joining a device wafer to a readout wafer in an IC hybridization step. The process allows for the formation of a high-quality LPCVD layer before the active devices are fabricated, ensuring no hazard to the active components. Another notable patent is the kinematic chip-to-chip bonding technology. This innovation integrates an IC with a waveguide and a v-groove array IC, maximizing optical coupling between an optical fiber and the waveguide. The use of kinematic pins and sockets facilitates automated alignment, enhancing the accuracy of the optical connections.

Career Highlights

Pomerene is currently employed at National Technology & Engineering Solutions of Sandia, LLC. His work at this organization has allowed him to push the boundaries of technology and contribute to cutting-edge research and development.

Collaborations

Some of his notable coworkers include David Bruce Burckel and Todd Bauer. Their collaborative efforts have further advanced the projects they are involved in, showcasing the importance of teamwork in innovation.

Conclusion

Andrew Pomerene's contributions to the field of technology through his patents and work at Sandia demonstrate his commitment to innovation. His advancements in photodetectors and integrated circuits are paving the way for future developments in the industry.