Corvallis, OR, United States of America

Andrew L Van Brocklin

This inventor holds 187 USPTO granted patents and 10 published patent applications, plus 4 CIPO patents and 24 EPO patents, primarily in Inkjet Printing Technology (CPC class B41J2-0458). Top assignees: Hewlett-Packard Development Company, L.p., Hewlett-Packard Company, Xaar Technology Limited. Active years: 1999-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andrew L Van Brocklin. Retrieved from https://idiyas.com/inventor/andrew-l-van-brocklin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 187 

% Patents Active = 41.7

 

 

Average Co-Inventor Count = 2.6

ph-index = 25

Forward Citations = 1,994(Granted Patents)

Forward Citations (Not Self Cited) = 1,940(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Corvalllis, OR (US) (2003)
  • Corvallis, CO (US) (2009)
  • Corvalis, OR (US) (2003 - 2010)
  • Covallis, OR (US) (2019)
  • Corvallis, OR (US) (1999 - 2024)

Company Filing History:


Years Active: 1999-2024

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Areas of Expertise:
Fluid Ejection
Printhead Design
Microelectromechanical Die
Impedance Measurement
Sintering Process
Temperature Regulation
Piezoelectric Assembly
Optical Fiber Detection
Drive Bubble Formation
Three-Dimensional Printing
Sensor Plate Measurement
Drop Count Storage
187 patents (USPTO):Explore Patents

Title: Andrew Van Brocklin: Innovator in 3D Printing and Support Structures

Introduction:

Meet Andrew Van Brocklin, a visionary inventor and patent holder based in Corvallis, Oregon. With an impressive portfolio of 172 patents, Andrew has made significant contributions to the fields of three-dimensional (3D) printing and support structures. This article delves into his latest patents, career highlights, collaborations, and showcases his significant contributions to the world of innovation.

Latest Patents:

Andrew's latest patents highlight his expertise in developing support structures and interfaces for 3D printing technology. One notable patent involves the use of a non-transitory computer readable storage medium to generate a modified object model with a support structure and an interface. This allows for the controlled release of the support structure after the 3D printed green part has been sintered. Another patent explores the use of dielectric agents and fusing agents to create regions with specific properties, such as dielectric or piezoelectric, in 3D printed parts.

Career Highlights:

Throughout his career, Andrew Van Brocklin has made valuable contributions to the innovation landscape. He has worked with renowned companies such as Hewlett-Packard Development Company, L.P., where he played a pivotal role in advancing 3D printing technology. His expertise and dedication have earned him a reputation as a thought leader in the field.

Collaborations:

Andrew's innovative mindset extends to collaborative efforts with his peers. Notably, he has worked alongside esteemed individuals such as Peter James Fricke and Daryl E Anderson, who share his passion for pushing the boundaries of 3D printing. These collaborations have fostered a fertile environment for the exchange of ideas, resulting in groundbreaking innovations.

Conclusion:

Andrew Van Brocklin stands as a key figure in the field of 3D printing and support structures. With an impressive patent portfolio and a dedication to pushing the boundaries of innovation, he continues to pave the way for advancements in this space. Through his work at esteemed companies like Hewlett-Packard Development Company, L.P., Andrew has left an indelible mark on the industry. As we look towards the future of 3D printing, Andrew's contributions will undoubtedly continue to inspire and shape the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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