The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Nov. 17, 2017
Hewlett-packard Development Company, L.p., Spring, TX (US);
Andrew Van Brocklin, Corvallis, OR (US);
Kevin P. DeKam, Corvallis, OR (US);
Vladek Kasperchik, Corvallis, OR (US);
Johnathon Holroyd, Corvallis, OR (US);
Douglas Pederson, Corvallis, OR (US);
Sterling Chaffins, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
In an example of a method for three-dimensional (3D) printing, a polymeric or polymeric composite build material is applied. A dielectric agent is selectively applied on at least a portion of the polymeric or polymeric composite build material. The dielectric agent includes a dielectric material having an effective relative permittivity (ε) value ranging from 1.1 to about 10,000. A fusing agent is selectively applied on the at least the portion of the polymeric or polymeric composite build material, and the polymeric or polymeric composite build material is exposed to radiation to fuse the at least the portion of the polymeric or polymeric composite build material to form a region of a layer of a 3D part. The region exhibits a dielectric property, a piezoelectric property, or a combination thereof.