Etobicoke, Canada

Andrew F Valy

This inventor holds 1 USPTO granted patent, plus 3 CIPO patents. Top assignee: Genpak, LLC. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andrew F Valy. Retrieved from https://idiyas.com/inventor/andrew-f-valy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Andrew F Valy: Innovator in Packaging Technology

Introduction

Andrew F Valy is a notable inventor based in Etobicoke, Canada. He has made significant contributions to the field of packaging technology, particularly through his innovative patent that enhances the functionality of packaging materials.

Latest Patents

Valy holds a patent for "Packaging roll stock with windows." This invention discloses a process for manufacturing a laminate designed for forming packages that feature one or more windows, allowing consumers to view the contents inside. The process involves extrusion laminating a heat-sealable second material onto a first material that has been perforated to define the windows. The resulting laminate and the heat-sealed packages produced from it represent a significant advancement in packaging design.

Career Highlights

Andrew F Valy is currently employed at Genpak, LLC, a company known for its innovative packaging solutions. His work at Genpak has allowed him to apply his expertise in developing practical and efficient packaging technologies.

Collaborations

Valy has collaborated with notable colleagues, including David A Coutts and Donald B Hilder, who have contributed to his projects and innovations in the packaging sector.

Conclusion

Andrew F Valy is a distinguished inventor whose work in packaging technology has led to practical advancements in the industry. His patent for packaging roll stock with windows exemplifies his commitment to innovation and efficiency in packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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