The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jul. 14, 2006
Applicants:

David A. Coutts, North York, CA;

Donald B. Hilder, Zephyr, CA;

Andrew G. Pattenden, Newmarket, CA;

Andrew F. Valy, Etobicoke, CA;

Inventors:

David A. Coutts, North York, CA;

Donald B. Hilder, Zephyr, CA;

Andrew G. Pattenden, Newmarket, CA;

Andrew F. Valy, Etobicoke, CA;

Assignee:

Genpak LP, Aurora, Ontario, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B31B 19/82 (2006.01); B32B 27/10 (2006.01); B32B 38/04 (2006.01); B65D 33/04 (2006.01); B32B 27/08 (2006.01); B29D 22/00 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 3/26 (2006.01); B32B 37/15 (2006.01); B32B 37/20 (2006.01);
U.S. Cl.
CPC ...
B31B 19/82 (2013.01); B29D 22/003 (2013.01); B32B 3/266 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 38/04 (2013.01); B65D 33/04 (2013.01); B31B 2219/9038 (2013.01); B32B 37/153 (2013.01); B32B 37/203 (2013.01); B32B 2038/042 (2013.01); B32B 2307/414 (2013.01); B32B 2309/02 (2013.01); B32B 2439/06 (2013.01); Y10T 428/1352 (2015.01); Y10T 428/24322 (2015.01);
Abstract

A process for manufacturing a laminate is disclosed. The laminate is for forming a package having one or more windows for viewing the contents of said package. The process comprises the step of extrusion laminating, onto a first material perforated by a hole for and defining each of said windows, a heat-sealable second material. A laminate produced by the process is also disclosed. A heat-sealed package produced with the laminate is also disclosed.


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