Andrew Dineen

Title: The Innovations of Andrew Dineen

Introduction

Andrew Dineen is an accomplished inventor based in Derry, NH (US). He has made significant contributions to the field of electronic components through his innovative patent. His work focuses on enhancing the efficiency and functionality of multichip modules.

Latest Patents

Dineen holds a patent for a "Method of fabricating a laminated substrate assembly chips-first." This invention involves a laminated substrate assembly chip first multichip module and a method of making it. The process includes a plurality of electronic components that are thinned to a predetermined thickness and mounted on a flat substrate in a precise position and orientation. A mechanical spacer layer, which includes a cured film and an adhesive, is bonded to the flat surface of the substrate surrounding the components. This mechanical spacer layer has a thickness approximately equal to the predetermined thickness of the components and features a pattern of holes corresponding to the precise position and orientation of the components mounted on the substrate. Finally, a cover layer is bonded over the mechanical layer and the tops of the components.

Career Highlights

Andrew Dineen is currently employed at Draper Laboratory, Inc., where he continues to innovate and develop new technologies. His work at Draper has allowed him to collaborate with other talented professionals in the field.

Collaborations

One of his notable coworkers is George V. Ives, with whom he has likely shared insights and expertise in their respective areas of specialization.

Conclusion

Andrew Dineen's contributions to the field of electronics through his innovative patent demonstrate his commitment to advancing technology. His work at Draper Laboratory, Inc. continues to impact the industry positively.