Andreas Schlögl

Title: The Innovations of Andreas Schlögl

Introduction

Andreas Schlögl is a notable inventor based in Ottobrunn, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of electronic devices.

Latest Patents

One of Schlögl's latest patents is for a molded semiconductor package with backside die metallization. This innovation involves manufacturing a semiconductor package by providing a semiconductor die with a terminal at one side and embedding it in a molding compound. The compound is designed to expose the material at the second side of the die while keeping the die itself protected. This design allows for efficient electrical connections, particularly in transistor applications.

Another significant patent is for a device that cools a surface rotating about a rotation axis. This device includes a container for a liquid coolant that co-rotates with the surface. An atomizer nozzle discharges the coolant in an atomized jet, effectively cooling the surface of electronic devices that generate heat, such as those used in computer tomography.

Career Highlights

Throughout his career, Schlögl has worked with prominent companies in the technology sector, including Infineon Technologies AG and Siemens Aktiengesellschaft. His experience in these organizations has contributed to his expertise in semiconductor innovations.

Collaborations

Schlögl has collaborated with notable colleagues such as Markus Schmitt and Hans-Joachim Schulze. These partnerships have likely fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Andreas Schlögl's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence the development of advanced electronic devices.