Delligsen, Germany

Andreas Nickut

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2009-2013

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Andreas Nickut

Introduction

Andreas Nickut is a notable inventor based in Delligsen, Germany. He has made significant contributions to the field of electrical engineering, particularly in the area of conductive connections on transparent substrates. With a total of 2 patents, his work showcases a blend of creativity and technical expertise.

Latest Patents

Nickut's latest patents include a method for conductively connecting a component on a transparent substrate. This invention outlines a process where an electrical component is connected to a conductive layer on a transparent substrate. The method involves applying soldering material to the component, which is then melted using energy from a source to create a strong, non-detachable connection. Another significant patent is for an electrical base connection with a transparent conductive layer. This invention describes a base connection on a transparent pane that features an electrically conductive layer divided into sections, allowing for effective electrical connections.

Career Highlights

Throughout his career, Andreas Nickut has worked with reputable companies such as Schott AG and Doeppner Bauelemente GmbH & Co. KG. His experience in these organizations has contributed to his development as an inventor and has provided him with a platform to innovate in his field.

Collaborations

Nickut has collaborated with notable individuals in the industry, including Bernd Albrecht and Rolf A O Schneider. These partnerships have likely enriched his work and expanded his innovative capabilities.

Conclusion

Andreas Nickut's contributions to the field of electrical engineering through his patents and collaborations highlight his role as a significant inventor. His innovative methods for conductive connections on transparent substrates demonstrate the potential for advancements in technology.

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