Schott Ag

Doeppner Bauelemente Gmbh & Co. Kg

Schneider + Fichtel Gmbh

Döppner Bauelemente Gmbh & Co. Kg

Andreas Nickut

Christian Henn

Wolfgang Moehl

Bernd Albrecht

Peter Kracht

Angelika Ullmann

Daniel Grimm

Matthias Anton

Rolf A O Schneider

Christoph Doeppner

Christoph Lothar Doeppner

Christoph Döppner

Ernst-Friedrich Duesing

Thomas Schmitz

Stefan Biethmann

Rüdiger Lüdeke

Christoph Lothar Döppner

The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established.

Method for conductively connecting a component on a transparent substrate

An electrical socket or base connection is provided on a preferably transparent pane or plate, particularly a base for lighting. The plate is provided with a preferably also transparent, electrically conductive layer. The base connection has an electrically conductive layer, which is subdivided into at least two sections separated from one another by a gap and connected to different poles of an electrical connection. In the vicinity of the separating gap, at least two electrically conductive areas are applied to the electrically conductive layer, and to them are electrically or mechanically connected the base connection. The areas are applied in the form of a layer of electrically conductive material, preferably by screen printing.

Electrical base connection with transparent conductive layer

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Delligsen, Germany

Andreas Nickut