Andreas M Van Der Putten

Title: Andreas M. Van Der Putten: Semiconductor and Selective Metallization Patents

Introduction

Andreas M. Van Der Putten is an inventor associated with Eindhoven, the Netherlands. His patent work includes methods for semiconductor-device manufacturing and for selectively depositing materials on glass. His portfolio includes 7 patents, and he is associated with U.S. Philips Corporation.

Latest Patents

One of Van Der Putten’s latest patents describes a method of manufacturing a semiconductor device by forming pyramid-shaped bumps on bond pads. The method uses an electroless metallization bath containing a stabilizer that suppresses the cathodic partial reaction. This helps the bumps grow without lateral overgrowth of the coating layer, while the stabilizer concentration determines their angle of inclination.

Another patent presents a method for selectively providing a pattern of material other than glass on a glass surface. An activating pretreatment using a polymer-stabilized palladium sol enables electroless metallization to deposit patterns, including transparent indium-tin oxide patterns. Polyvinyl alcohol is given as an example of a suitable polymer.

Career Highlights

Van Der Putten’s listed work at U.S. Philips Corporation connects his inventions with practical approaches to metallization and semiconductor fabrication. His patents address both the controlled formation of structures on semiconductor bond pads and the selective deposition of patterned materials on glass.

Collaborations

His listed coworkers include Johannes M. Rikken and Edwin T. Swart. Their names are associated with Van Der Putten’s professional and patent-related context.

Conclusion

Andreas M. Van Der Putten’s patent work reflects a focus on precise metallization processes, from pyramid-shaped semiconductor bumps to selectively patterned coatings on glass.