Location History:
- Munich, DE (2010 - 2017)
- Laaber, DE (2017 - 2019)
Company Filing History:
7 out of 734 
2 out of 213 
2 out of 1,132 
Years Active: 2010-2025
Title: Innovations of Andreas Link
Introduction
Andreas Link is a prominent inventor based in Munich, Germany. He has made significant contributions to the field of technology, particularly in the area of circuit design and heat dissipation. With a total of 11 patents to his name, Link has demonstrated a commitment to advancing innovation in his field.
Latest Patents
One of Link's latest patents is titled "Three-dimensional patterned module exterior surface for improved heat dissipation and method of fabricating." This invention involves a module that includes a protective shield with a three-dimensional (3D) pattern designed to enhance the rate of heat dissipation. As circuit components continue to shrink in size, the heat density within modules increases. The invention addresses this challenge by improving the surface area of the overmold, thereby enhancing heat dissipation and ultimately improving the performance and longevity of circuit components.
Another notable patent is "Circuit for suppressing signals adjacent to a passband." This circuit features a power amplifier port, an antenna port, and a ladder network that connects the two. The design includes multiple acoustic resonators that work together to create notches below and above the passband, effectively suppressing unwanted signals.
Career Highlights
Throughout his career, Andreas Link has worked with several notable companies, including Epcos AG and Snaptrack Incorporated. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Link has collaborated with several professionals in his field, including Stephan Marksteiner and Edgar Schmidhammer. These collaborations have further enriched his work and contributed to the development of his patents.
Conclusion
Andreas Link's contributions to technology through his innovative patents highlight his expertise and dedication to improving circuit design and heat dissipation. His work continues to influence the industry and pave the way for future advancements.