The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Nov. 18, 2022
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Loizos Loizou, Grasbrunn, DE;

Tobias Mangold, Huglfing, DE;

Andreas Link, Laaber, DE;

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 2201/10431 (2013.01);
Abstract

A module includes a protective shield with a three-dimensional (3D) pattern to increase a rate of heat dissipation. As circuit components get smaller in size, more circuit components can fit into a module, thereby increasing heat density in the module. Some of the heat in a module is conducted through an overmold disposed on the circuit components. The heat conducted through the overmold then dissipates through an optional protective shield on an exterior surface of the overmold. A rate of heat dissipation depends on the surface area of the overmold and, if any, the protective shield. In an exemplary aspect, a 3D pattern is formed in the exterior surface of the overmold to increase the surface area to increase a rate of heat dissipation from the module. Improved heat dissipation improves performance and product life of the circuit components in the module.


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