Vaterstetten, Germany

Andreas Franz

This inventor holds 2 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignees: Qualcomm Incorporated, Snaptrack Incorporated. Active years: 2022-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andreas Franz. Retrieved from https://idiyas.com/inventor/andreas-franz-pmgrgxvt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.8

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Vaterstetten, DE (2022)
  • Munich, DE (2023)

Company Filing History:


Years Active: 2022-2023

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Andreas Franz

Introduction

Andreas Franz is a notable inventor based in Vaterstetten, Germany. He has made significant contributions to the field of technology, particularly in the area of packaging and module design. With a total of two patents to his name, Franz has demonstrated a commitment to innovation and advancement in his field.

Latest Patents

Franz's latest patents include a package comprising a substrate, an integrated device, and an encapsulation layer with an undercut. This invention features a substrate that includes a first surface, where the integrated device is coupled. The first encapsulation layer is positioned over the substrate and the integrated device, incorporating an undercut relative to the side surface of the integrated device. A void is strategically located between the integrated device and the substrate's first surface, surrounded laterally by the undercut of the encapsulation layer.

Another significant patent by Franz is related to stacked modules. This invention involves a module with a lower component that has a material in which at least one first structural element is embedded. The upper component of the module also contains a material with at least a second component embedded. These components are stacked and are electrically connected and mechanically linked. This invention allows for the miniaturization of modules concerning surface area and height, as well as achieving greater integration through 3D packaging.

Career Highlights

Throughout his career, Andreas Franz has worked with prominent companies such as Qualcomm Incorporated and Snaptrack Incorporated. His experience in these organizations has contributed to his expertise and innovative capabilities in the technology sector.

Collaborations

Franz has collaborated with notable individuals in his field, including Claus Reitlinger and Alberto Jose Teixeira De Queiros. These collaborations have likely enriched his work and contributed to his success as an inventor.

Conclusion

Andreas Franz's contributions to technology through his patents and career experiences highlight his role as an influential inventor. His work continues to impact the field of packaging and module design, showcasing the importance of innovation in advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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