The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2023
Filed:
Oct. 08, 2020
Qualcomm Incorporated, San Diego, CA (US);
Alberto Jose Teixeira De Queiros, Munich, DE;
Andreas Franz, Munich, DE;
Anna Katharina Krefft, Munich, DE;
Claus Reitlinger, Wolnzach, DE;
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
A package that includes a substrate, an integrated device, a first encapsulation layer and a void. The substrate includes a first surface. The integrated device is coupled to the first surface of the substrate. The first encapsulation layer is located over the first surface of the substrate and the integrated device. The first encapsulation layer includes an undercut relative to a side surface of the integrated device. The void is located between the integrated device and the first surface of the substrate. The void is laterally surrounded by the undercut of the encapsulation layer.