Company Filing History:
Years Active: 2005
Title: Ananda P De Silva: Innovator in MEMS Packaging Technology
Introduction
Ananda P De Silva is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of Micro-Electro-Mechanical Systems (MEMS) packaging technology. His innovative work has led to advancements that enhance the performance and reliability of MEMS devices.
Latest Patents
Ananda holds a patent for a method and apparatus for wafer level MEMS packaging. This patent, titled "Wafer level MEMS packaging," describes an exemplary method that includes an electromagnetic (EM) shielding array of dielectric lid elements sealed to a MEMS device die array. The invention aims to produce a sealed MEMS device package array, improving hermetic sealing and EM shielding for various MEMS devices. An exemplary embodiment of this invention provides for wafer level packaging of RF MEMS switches prior to device singulation. Ananda has 1 patent to his name.
Career Highlights
Ananda is currently associated with Freescale Semiconductor, Inc., where he applies his expertise in MEMS technology. His work at Freescale has positioned him as a key player in the development of advanced packaging solutions for MEMS devices.
Collaborations
Throughout his career, Ananda has collaborated with notable colleagues, including Jong-Kai Lin and William H Lytle. These collaborations have contributed to the advancement of MEMS technology and have fostered innovation within the field.
Conclusion
Ananda P De Silva is a distinguished inventor whose work in MEMS packaging technology has made a significant impact on the industry. His innovative approaches continue to shape the future of MEMS devices, ensuring enhanced performance and reliability.