Freescale Semiconductor,inc.

Ananda P De Silva

Owen R Fay

William H Lytle

Henry G Hughes

Craig S Amrine

Jong-Kai Lin

Steven Markgraf

An exemplary method and apparatus for MEMS device wafer level and/or array packaging comprises inter alia an EM shielding array of dielectric lid elements () sealed to a MEMS device die array () to produce a sealed MEMS device package array (). Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve hermetic sealing and/or EM shielding for any MEMS device. An exemplary embodiment of the present invention representatively provides for wafer level packaging of RF MEMS switches prior to device singulation.

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Chandler, AZ, United States of America

Ananda P De Silva