Amarjit S Rai, a prolific inventor based in Vestal, NY (US), has made significant strides in the field of technology with an impressive portfolio of 7 patents. His groundbreaking work in the fabrication of metalized blind vias showcases his ingenuity and expertise in the realm of innovation.

Latest Patents:

Amarjit S Rai's latest patents revolve around the fabrication of a metalized blind via. This innovative method involves forming a dielectric layer on a metallic layer, followed by laser drilling a depression in the dielectric layer to create a carbon film on the sidewall of the depression. The carbon film, in conductive contact with the metallic layer, allows for the electroplating of a continuous layer of metal directly onto it. This process eliminates the need for an electrolessly plated layer underneath, streamlining the manufacturing of high-quality metalized blind vias.

Career Highlights:

Currently affiliated with International Business Machines Corporation (IBM), Amarjit S Rai continues to push the boundaries of technological advancements. His tenure at IBM has been marked by a dedication to pioneering solutions that address complex industry challenges and enhance overall productivity and efficiency.

Collaborations:

Amarjit S Rai has collaborated with esteemed professionals in the field, including coworkers Kostas I Papathomas and Ashwinkumar C Bhatt. Together, they have contributed to the development of cutting-edge technologies and solutions that have garnered recognition within the industry.

Conclusion:

Amarjit S Rai's innovative spirit and dedication to advancing technology have cemented his position as a prominent figure in the world of inventors. His pioneering work in the fabrication of metalized blind vias underscores his commitment to driving progress and innovation in the ever-evolving landscape of technology.

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