Allen S Lim

Title: The Innovations of Allen S Lim

Introduction

Allen S Lim is a notable inventor based in Milpitas, CA. He has made significant contributions to the field of integrated circuit technology. With a total of 2 patents to his name, Lim has demonstrated a commitment to advancing electronic design and manufacturing.

Latest Patents

One of his latest patents is titled "Thermal improvement of integrated circuit packages." This invention involves an integrated circuit package that includes an active semiconductor device layer and at least one heat-transfer semiconductor layer. The heat-transfer semiconductor layer is designed to have a coefficient of thermal expansion that closely matches that of the active semiconductor device layer. Another significant patent is "Method of generating a leadframe IC package model, a leadframe modeler and an IC design system." This method outlines a process for generating a model of a leadframe IC package, which includes adding connectivity information to a geometric representation of the leadframe and formatting the leads to represent BGA points of contact for the IC die.

Career Highlights

Allen S Lim is currently employed at LSI Corporation, where he continues to innovate in the field of integrated circuits. His work has contributed to the development of more efficient and reliable electronic components.

Collaborations

Throughout his career, Lim has collaborated with several talented individuals, including Donald Earl Hawk, Jr. and Stephen M King. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Allen S Lim is a distinguished inventor whose work in integrated circuit technology has led to valuable patents and advancements in the field. His contributions continue to influence the industry and inspire future innovations.