Lsi Corporation

Allen S Lim

Atila Mertol

Donald Earl Hawk, Jr

Ashley Rebelo

Zeki Z Celik

Jeffrey M Klemovage

John J Krantz

Stephen M King

Richard J Sergi

An integrated circuit package comprising an active semiconductor device layer and at least one heat-transfer semiconductor layer on the active semiconductor device layer. The heat-transfer semiconductor layer has a coefficient of thermal expansion that substantially matches a coefficient of thermal expansion of the active semiconductor device layer.

Thermal improvement of integrated circuit packages

A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.

Method of generating a leadframe IC package model, a leadframe modeler and an IC design system

Growing community of inventors

Milpitas, CA, United States of America

Allen S Lim