The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2013

Filed:

Jun. 16, 2009
Applicants:

Donald E. Hawk, Jr., King of Prussia, PA (US);

Stephen M. King, Hamburg, PA (US);

Jeffrey M. Klemovage, Breinigsville, PA (US);

John J. Krantz, Northampton, PA (US);

Allen S. Lim, Milpitas, CA (US);

Ashley Rebelo, Allentown, PA (US);

Richard J. Sergi, Bethlehem, PA (US);

Inventors:

Donald E. Hawk, Jr., King of Prussia, PA (US);

Stephen M. King, Hamburg, PA (US);

Jeffrey M. Klemovage, Breinigsville, PA (US);

John J. Krantz, Northampton, PA (US);

Allen S. Lim, Milpitas, CA (US);

Ashley Rebelo, Allentown, PA (US);

Richard J. Sergi, Bethlehem, PA (US);

Assignee:

LSI Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/455 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.


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