Alfred Kersch

Title: Alfred Kersch: Innovator in Substrate Processing Technologies

Introduction

Alfred Kersch is a notable inventor based in Munich, Germany. He has made significant contributions to the field of substrate processing, holding a total of 2 patents. His work focuses on innovative methods and apparatuses that enhance the efficiency and effectiveness of substrate wafer processing.

Latest Patents

Kersch's latest patents include an "Apparatus for processing a substrate wafer and method for operating same." This invention features a reaction chamber, a wafer holder designed to hold the substrate wafer, and a susceptor. A temperature sensor, preferably a thermocouple with two junctions, is included to measure the temperature difference between the susceptor and the substrate wafer. Another significant patent is the "Method for depositing a layer on a substrate wafer with a sputtering." This method utilizes a collimator with cylindrical holes to minimize the lateral component of a particle flux, ensuring that the cylindrical holes are aligned perpendicularly to the substrate wafer.

Career Highlights

Throughout his career, Alfred Kersch has worked with prominent companies, including Siemens Aktiengesellschaft and Siemens Aktiengesellschaft AG. His experience in these organizations has allowed him to develop and refine his innovative ideas in substrate processing technologies.

Collaborations

Kersch has collaborated with notable colleagues such as Thomas Schafbauer and Christoph Werner. Their combined expertise has contributed to advancements in the field of substrate processing.

Conclusion

Alfred Kersch's contributions to substrate processing technologies through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of substrate wafer processing.