Location History:
- Franklin Park, IL (US) (1987 - 1989)
- Palatine, IL (US) (1993 - 2001)
Company Filing History:
Years Active: 1987-2001
Title: Alfred G Ocken: Innovator in Feedthrough Via Connections
Introduction
Alfred G Ocken is a notable inventor based in Palatine, IL (US). He has made significant contributions to the field of electrical connections, particularly through his innovative methods for constructing feedthrough via connections. With a total of 6 patents to his name, Ocken's work has had a considerable impact on the industry.
Latest Patents
Ocken's latest patents include a method for constructing a feedthrough via connection on a solder-resistant layer. This method involves a metallic plate, preferably made of aluminum, with a solderable contact area composed of copper. An electrically insulating adhesive layer is applied to the plate, featuring a feedthrough via aligned with the contact area. A flexible composite polyimide substrate is then placed on the adhesive layer, which also has a via with a solderable area. Solder is applied to this area, and the assembly is heated to create an electrical connection. The adhesive layer acts as a solder mask, preventing solder from flowing outside the defined area.
Career Highlights
Ocken has spent a significant portion of his career at Motorola Corporation, where he has been able to apply his innovative ideas and technical expertise. His work has contributed to advancements in electronic manufacturing and design.
Collaborations
Some of Ocken's notable coworkers include Fred E Ostrem and Nathan A Unterman. Their collaborative efforts have further enhanced the development of innovative technologies in their field.
Conclusion
Alfred G Ocken's contributions to the field of electrical connections through his patented methods demonstrate his innovative spirit and technical prowess. His work continues to influence the industry and inspire future advancements.