The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2001
Filed:
Mar. 24, 1995
Fred E. Ostrem, Long Grove, IL (US);
Alfred G. Ocken, Palatine, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (,), or rigidizer, preferably composed of an aluminum material. A solderable contact area (,), is located on the plate (,). This contact area (,) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (,) is disposed onto the plate (,). This adhesive layer (,) has a feedthrough via (,) disposed therethrough aligned with the contact area (,). Then, a substrate (,), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (,). This flexible substrate (,) has a via (,) disposed therethrough with a solderable area (,) disposed thereon. Then, a quantity of solder (,) is disposed onto the solderable area (,), and the assembly (,) is heated so that the solder (,) flows into the vias (,) and (,), thereby providing an electrical connection including the solderable area (,) of the via (,), the solder (,), and the contact area (,). During this reflow step, the structure of the adhesive layer (,) acts as a soldermask preventing the solder (,) from flowing outside of an area defined by the via (,).