Motorola Corporation

Alfred G Ocken

Fred E Ostrem

Michael L Charlier

Michael I Petrites

Timothy S Fisher

Raymond E Nordbrock

Nathan A Unterman

Raymond J Kowieski

A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (,), or rigidizer, preferably composed of an aluminum material. A solderable contact area (,), is located on the plate (,). This contact area (,) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (,) is disposed onto the plate (,). This adhesive layer (,) has a feedthrough via (,) disposed therethrough aligned with the contact area (,). Then, a substrate (,), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (,). This flexible substrate (,) has a via (,) disposed therethrough with a solderable area (,) disposed thereon. Then, a quantity of solder (,) is disposed onto the solderable area (,), and the assembly (,) is heated so that the solder (,) flows into the vias (,) and (,), thereby providing an electrical connection including the solderable area (,) of the via (,), the solder (,), and the contact area (,). During this reflow step, the structure of the adhesive layer (,) acts as a soldermask preventing the solder (,) from flowing outside of an area defined by the via (,).

Feedthrough via connection on solder resistant layer

A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. Then, a quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).

Feedthrough via connection

An electronic module assembly includes a relatively thin, bendable base plate having at least one bend axis along which the base plate is bent over on itself to provide an enclosure. An inner surface of the base plate supports at least one, and preferably two, relatively thicker metal plates, one on each side of the bend axis, each metal plate acting as a heatsink for circuit components mounted thereon.

Laminated electronic module assembly

A heat sink assembly for a plurality of transistors includes specially-formed spring clips and a specially-formed heat sink to hold the transistors firmly on the heat sink, and a lead protector that mates with the heat sink to receive and protect the leads of the transistors during handling. The lead protector and the heat sink include integrally-formed fastener/alignment pins for aligning the lead protector with the heat sink, and for aligning the completed heat sink assembly with a circuit board and for holding the assembly securely fastened to the circuit board. A particular feature of the lead protector permits it to mate with heat sink in a first discrete position in which it receives and protects the transistor leads, and to more closely mate with the heat sink in a second discrete position in which the transistor leads pass through the lead protector and into target holes in the circuit board.

Heat sink assembly for densely packed transistors

An electrical component assembly (10), comprising a rectifier bridge, utilizes a protective cover (30) for mechanical protection of semiconductor diode dies (11, 12) mounted on an aluminum heat sink support carrier (16). Channels (37, 37B) with effective openings (40, 40A) therein are provided in a top surface (38) of the protective cover to facilitate applying an environmental sealing materail (45) through said channels and openings to the semiconductor diode dies of the electrical assembly as well as to various critical electrical interconnections (48) in the electrical assembly. By utilizing the mechanically protective cover to also provide for guiding the application of an environmental sealing material for the electrical assembly, extensive fixturing in providing a desired electrical assembly is minimized, the assembly is rendered more readily manufacturable, and protection of the assembly is provided even during the step of dispensing the sealing material.

Electrical component assembly and method of manufacture thereof

An inexpensive semi enclosed alternator provides high power prolonged operation in environments having particle contamination in the ambient atmosphere. An alternator housing has front and rear housing portions, and a drive shaft carrying a rotor assembly is within the housing. A drive shaft extension from the housing holds a fan assembly. The rear housing portion has cylindrical sidewalls joined to a closed end portion 27 and forms an air sealed cavity except for an open end facing the front housing portion. The front housing portion comprises cylindrical sidewalls, having through-openings therein, which terminate in a first end opening 31, facing rear housing open end 28, and a substantially open second end opening 30 facing the fan assembly and the ambient atmosphere. Preferably rotor and stator assemblies, and rectifying diodes, are positioned within the housing substantially between the through openings and the closed end portion of the rear housing. During normal drive shaft rotation, the fan assembly draws cooling ambient air into the housing through the through-openings 33, and this air is then drawn out of the housing through the second end opening 30 of the front housing portion. This causes cooling air turbulence within the housing, while not directly exposing most internal alternator components to particle contamination in the ambient atmosphere. A voltage regulator is provided in a sealed protective cavity external to the internal cavity. A heatsink which is part of the voltage regulator is utilized to form part of the walls that create the protective cavity.

Growing community of inventors

Palatine, IL, United States of America

Alfred G Ocken