Alex Yucun Dou

Title: Alex Yucun Dou: Innovator in Component Carrier Technology

Introduction

Alex Yucun Dou is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of component carrier technology, holding a total of 2 patents. His work focuses on enhancing the reliability and efficiency of electronic components.

Latest Patents

One of his latest patents is titled "Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric." This invention involves a component carrier that includes an electrically insulating layer structure with a through hole extending between its main surfaces. The design features an electrically conductive bridge structure that connects the opposing sidewalls of the insulating layer, ensuring electrical reliability. The vertical thickness of the insulating layer is limited to no more than 200 µm, while the narrowest vertical thickness of the bridge structure is at least 20 µm.

Career Highlights

Alex Yucun Dou is currently employed at AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading company in the field of advanced technology and system solutions. His innovative work has positioned him as a key player in the development of new technologies in the electronics sector.

Collaborations

Throughout his career, Alex has collaborated with talented professionals, including Ismadi Bin Ismail and Valerian Yun Khim Chung. These collaborations have further enriched his work and contributed to the advancement of technology in his field.

Conclusion

Alex Yucun Dou is a notable inventor whose work in component carrier technology has led to significant advancements in the electronics industry. His patents reflect his commitment to innovation and reliability in electronic components.