Albert Wong Chan

Albert Wong Chan is a prominent inventor based in Cupertino, CA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His innovative approaches have paved the way for advancements in the manufacturing and assembly of electronic components.

Latest Patents

Among his latest patents is a method for joining large substrates. This method involves using a liquid thermoset polymer to join large area semiconductor substrates, such as wafers or circuit boards. The process allows for the substrates to be pressed together, enabling the liquid thermoset to flow outward toward the edges. Once cured, the polymer forms a strong bond between the substrates. Another notable patent is a stencil and method for depositing solder. This method utilizes a polymeric stencil that aligns with a conductive region of a substrate, allowing for precise solder application without removing any solder paste during the stencil's removal.

Career Highlights

Albert Wong Chan is currently employed at Fujitsu Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in enhancing the efficiency and reliability of electronic devices. His patents reflect a deep understanding of materials and processes that are critical in the electronics industry.

Collaborations

Throughout his career, Albert has collaborated with notable colleagues, including Mark Thomas McCormack and Solomon I Beilin. These collaborations have further enriched his work and contributed to the development of cutting-edge technologies.

Conclusion

Albert Wong Chan's contributions to semiconductor technology through his innovative patents demonstrate his expertise and commitment to advancing the field. His work continues to influence the electronics industry, making him a key figure in the realm of invention and innovation.