The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Jan. 08, 2001
Albert W. Chan, Cupertino, CA (US);
Michael G. Lee, San Jose, CA (US);
Mark Thomas Mccormack, Livermore, CA (US);
Solomon I. Beilin, San Carlos, CA (US);
Albert W. Chan, Cupertino, CA (US);
Michael G. Lee, San Jose, CA (US);
Mark Thomas McCormack, Livermore, CA (US);
Solomon I. Beilin, San Carlos, CA (US);
Fujitsu Limited, Kawasaki, JP;
Abstract
A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.