Sunnyvale, CA, United States of America

Albert A Onderick, Ii

This inventor holds 1 USPTO granted patent. Top assignee: Apple Inc.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Albert A Onderick, Ii. Retrieved from https://idiyas.com/inventor/albert-a-onderick-ii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Albert A Onderick, II: Innovator in Printed Circuit Board Technology

Introduction

Albert A Onderick, II is a notable inventor based in Sunnyvale, CA. He has made significant contributions to the field of printed circuit board technology. His innovative work focuses on enhancing the density of vertical interconnect paths in printed circuit boards.

Latest Patents

Albert A Onderick, II holds a patent for a technology titled "Segmented Via for Vertical PCB Interconnect." This invention involves printed circuit boards that feature an increased density of vertical interconnect paths, along with methods for their manufacture. One example of his innovation provides a printed circuit board with a plurality of segmented vias that extend through the interior layers. These segmented vias are formed from portions of vias within the interior layers, and the areas between three or more segmented vias can be filled with resin or other materials.

Career Highlights

Albert A Onderick, II is currently employed at Apple Inc., where he continues to push the boundaries of technology in printed circuit boards. His work has been instrumental in developing advanced solutions that meet the growing demands of modern electronics.

Collaborations

He has collaborated with notable coworkers, including Mark J Beesley and Anne M Mason, contributing to a dynamic and innovative work environment.

Conclusion

Albert A Onderick, II is a key figure in the advancement of printed circuit board technology, with a focus on increasing interconnect density through innovative methods. His contributions are shaping the future of electronic design and manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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