Shanghai, China

Alan G Wang

This inventor holds 2 USPTO granted patents. Top assignee: Ppg Industries Ohio, Inc.. Active years: 2011-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alan G Wang. Retrieved from https://idiyas.com/inventor/alan-g-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2011-2013

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2 patents (USPTO):Explore Patents

Title: Alan G Wang: Innovator in Multi-layer Circuit Assembly

Introduction

Alan G Wang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of circuit assembly, holding a total of 2 patents. His innovative approaches have paved the way for advancements in multi-layer circuit technology.

Latest Patents

Alan's latest patents include a process for fabricating a multi-layer circuit assembly. This process involves several steps, including providing a substrate with a high density of vias, applying a dielectric coating, and etching to form an electrical circuit pattern. The detailed methodology ensures the creation of efficient and reliable circuit assemblies.

Career Highlights

Throughout his career, Alan has worked with notable companies such as PPG Industries Ohio, Inc. and PPG Industries Chio, Inc. His experience in these organizations has contributed to his expertise in circuit assembly technologies.

Collaborations

Alan has collaborated with various professionals in his field, including Kevin C Olson. These partnerships have enhanced his work and led to innovative solutions in circuit design and fabrication.

Conclusion

Alan G Wang is a distinguished inventor whose work in multi-layer circuit assembly has made a lasting impact on the industry. His patents and career achievements reflect his dedication to innovation and excellence in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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