Neerpelt, Belgium

Alain De Bock

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Assembleon B.v.. Active years: 2023-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alain De Bock. Retrieved from https://idiyas.com/inventor/alain-de-bock

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Alain De Bock

Introduction

Alain De Bock is a notable inventor based in Neerpelt, Belgium. He has made significant contributions to the field of die attach systems, holding a total of 2 patents. His work focuses on improving the efficiency and accuracy of die attachment processes in various applications.

Latest Patents

Alain De Bock's latest patents include innovative methods and systems for operating die attach systems. One of his patents describes a method that involves providing a verification substrate designed to receive multiple die. This substrate includes several reference markers, which are crucial for aligning the die accurately. The imaging system integrated into the die attach system plays a vital role in determining the alignment by capturing images of each die with the corresponding reference markers. Another patent details the die attach system itself, emphasizing the importance of the verification substrate and the imaging system in achieving precise alignment.

Career Highlights

Throughout his career, Alain De Bock has worked with prominent companies such as Assembleon B.V. and Assembléon B.V. His experience in these organizations has allowed him to refine his skills and contribute to advancements in die attach technology.

Collaborations

Alain has collaborated with various professionals in his field, including his coworker René Bouman. Their joint efforts have furthered the development of innovative solutions in die attachment processes.

Conclusion

Alain De Bock's contributions to the field of die attach systems demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the technical challenges in this area, and his work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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