The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Jan. 03, 2023
Applicant:
Assembléon B.v., Eindhoven, NL;
Inventors:
Alain De Bock, Neerpelt, BE;
René Bouman, Vught, NL;
Assignee:
Assembleon B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2005.12); H01L 21/67 (2005.12); H01L 23/00 (2005.12); H01L 23/544 (2005.12);
U.S. Cl.
CPC ...
H01L 21/681 (2012.12); H01L 21/67144 (2012.12); H01L 23/544 (2012.12); H01L 24/75 (2012.12); H01L 24/83 (2012.12); H01L 2224/75001 (2012.12); H01L 2224/75702 (2012.12); H01L 2224/75753 (2012.12); H01L 2224/75755 (2012.12); H01L 2224/83132 (2012.12); H01L 2224/8318 (2012.12);
Abstract
A method of operating a die attach system is provided. The method includes the step of providing a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The method also includes the step of imaging each of the plurality of die with respective ones of the plurality of substrate reference markers using an imaging system of the die attach system for determining an alignment of the plurality of die with the verification substrate.