Kitaadachi-gun, Japan

Akira Yamakami

This inventor holds 6 USPTO granted patents and 2 published patent applications. Top assignees: Dic Corporation, Dic Corporation (Tokyo), Sun Chemical Corporation. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akira Yamakami. Retrieved from https://idiyas.com/inventor/akira-yamakami

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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6 patents (USPTO):Explore Patents

Title: Akira Yamakami: Innovator in Pressure-Sensitive Adhesive Technology

Introduction

Akira Yamakami is a notable inventor based in Kita-adachi-gun, Japan. He has made significant contributions to the field of adhesive technology, particularly in the development of pressure-sensitive adhesive tapes. With a total of 6 patents to his name, Yamakami's work showcases his innovative approach to solving complex problems in adhesive applications.

Latest Patents

Yamakami's latest patents include advancements in pressure-sensitive adhesive tapes that exhibit high-load holding power, temporal repeelability, and storage stability. One of his inventions features an adhesive tape that consists of a substrate layer and an adhesive layer. The substrate layer is designed to have a breaking stress ranging from 1 to 100 MPa and an elongation at break between 300% and 3000%. The adhesive layer incorporates a tackifier resin and a triblock copolymer, which is characterized by a specific repeating unit structure.

Another patent focuses on an adhesive tape that combines high-load holding power with initial adhesive strength and repeelability. This adhesive layer also contains filler particles and a triblock copolymer, with a defined relationship between the average particle size of the filler and the thickness of the adhesive layer. These innovations reflect Yamakami's commitment to enhancing the performance and versatility of adhesive products.

Career Highlights

Throughout his career, Akira Yamakami has worked with prominent companies, including Dic Corporation. His experience in these organizations has allowed him to refine his skills and contribute to the development of cutting-edge adhesive technologies.

Collaborations

Yamakami has collaborated with talented individuals such as Daisuke Watanabe and Kota Suetsugu. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Akira Yamakami's contributions to the field of adhesive technology are noteworthy and impactful. His innovative patents and collaborations highlight his dedication to advancing adhesive solutions. Yamakami's work continues to influence the industry and inspire future innovations in adhesive technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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