The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Jul. 20, 2022
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Daisuke Watanabe, Saitama, JP;

Kota Suetsugu, Saitama, JP;

Akira Yamakami, Saitama, JP;

Yumi Kagiyama, Saitama, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/08 (2006.01); C09J 7/38 (2018.01); C09J 153/02 (2006.01);
U.S. Cl.
CPC ...
C09J 11/08 (2013.01); C09J 7/38 (2018.01); C09J 153/02 (2013.01); C09J 2301/302 (2020.08); C09J 2301/408 (2020.08); C09J 2301/414 (2020.08);
Abstract

An adhesive tape with high repeelability from the state that a portion of the adhesive tape has already been peeled from an adherend is provided. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 90 MPa and an elongation at break in a range of 400% to 3000%. The adhesive tape satisfies the following relational expression (i): [Math. 1] P/P≤0.9 (i). Pdenotes an initial cleavage strength N/cmof the adhesive tape, and Pdenotes a cleavage strength N/cmwhen the adhesive tape is stretched by 400%.


Find Patent Forward Citations

Watanabe, Daisuke. (2026). Pressure-sensitive adhesive tape (U.S. Patent No. 12577441). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12577441

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…