Himeji, Japan

Akira Kitashima

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Nichirin Co., Ltd.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akira Kitashima. Retrieved from https://idiyas.com/inventor/akira-kitashima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Akira Kitashima: Innovator in Laser Bonding Technology

Introduction

Akira Kitashima is a notable inventor based in Himeji, Japan. He has made significant contributions to the field of laser bonding technology. His innovative approach has led to advancements that enhance the efficiency and effectiveness of bonding processes.

Latest Patents

Kitashima holds a patent for a laser bonding method and device. This invention involves a unique process where a resin pipe and a resin member are fixed to a setting portion on the front side of a base. A timing pulley, located on the back side of the base and equipped with a light emission unit, rotates to apply laser light to the junction between the resin pipe and the resin member. This method allows for the fusion and joining of the entire outer circumferential surface of the resin pipe with the inner circumferential surface of the resin member, accommodating various shapes and sizes.

Career Highlights

Throughout his career, Kitashima has been associated with Nichirin Co., Ltd., where he has played a pivotal role in developing innovative bonding solutions. His work has not only advanced the technology but has also contributed to the company's reputation in the industry.

Collaborations

Kitashima collaborates with Takao Maeda, a talented woman who shares his passion for innovation. Together, they work on projects that push the boundaries of laser bonding technology.

Conclusion

Akira Kitashima's contributions to laser bonding technology exemplify the spirit of innovation. His patent and collaborative efforts continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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