Akira Horie

Title: Akira Horie: Innovator in Maleimide Resin Technology

Introduction

Akira Horie is a prominent inventor based in Tokyo, Japan. He is known for his contributions to the field of resin technology, particularly in the development of maleimide resin compositions. His innovative work has led to advancements in various applications, including printed wiring boards and semiconductor packages.

Latest Patents

Horie holds a patent for a maleimide resin composition that includes a combination of specific components. This composition consists of (A) one or more maleimide compounds with multiple N-substituted maleimide groups, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer. The resulting products from this patent include a prepreg, resin film, laminated board, printed wiring board, and semiconductor package, all utilizing the maleimide resin composition. He has 1 patent to his name.

Career Highlights

Horie is currently employed at Resonac Corporation, where he continues to push the boundaries of resin technology. His work has significantly impacted the industry, leading to more efficient and effective materials for electronic applications.

Collaborations

Horie collaborates with talented individuals such as Chihiro Hayashi and Minoru Kakitani, contributing to a dynamic work environment that fosters innovation.

Conclusion

Akira Horie's contributions to maleimide resin technology exemplify the spirit of innovation in the field. His work not only enhances product performance but also paves the way for future advancements in materials science.