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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12324105 B1

PDFFull Text
Date of Patent:
Jun. 03, 2025

Filed:

Nov. 16, 2021

Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package

Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Chihiro Hayashi, Tokyo, JP;

Minoru Kakitani, Tokyo, JP;

Takao Tanigawa, Tokyo, JP;

Ryuji Akebi, Tokyo, JP;

Naoyoshi Sato, Tokyo, JP;

Akira Horie, Tokyo, JP;

Assignee:

Resonac Corporation, Tokyo, JP;

Attorney:

FITCH, EVEN, TABIN & FLANNERY, LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); C07D 207/448 (2006.01); C07D 207/452 (2006.01); C08K 5/00 (2006.01); C08K 5/08 (2006.01); C08K 5/16 (2006.01); C08K 5/20 (2006.01); C08K 5/3415 (2006.01); C08L 25/12 (2006.01); C08L 25/16 (2006.01); C08L 27/06 (2006.01); C08L 33/18 (2006.01); C08L 35/00 (2006.01); C08L 39/04 (2006.01); C08L 51/04 (2006.01); C08L 51/08 (2006.01); C08L 69/00 (2006.01); H01L 23/498 (2006.01); H05K 1/03 (2006.01); H05K 3/12 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4652 (2013.01); C08L 39/04 (2013.01); H01L 23/49822 (2013.01); H05K 1/0353 (2013.01); H05K 3/1283 (2013.01); C08L 2203/20 (2013.01); H05K 2201/10007 (2013.01); H05K 2203/068 (2013.01);
Abstract

Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.

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