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Years Active: 2022
Title: Akiko Umeda: Innovator in Die Bonding Materials
Introduction
Akiko Umeda is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of light-emitting devices through her innovative work in die bonding materials. Her expertise and creativity have led to the development of a patented technology that enhances the performance of light-emitting devices.
Latest Patents
Umeda holds a patent for a die bonding material, light-emitting device, and method for producing a light-emitting device. The invention provides a die bonding material that contains a specific component (A) and a solvent, with a refractive index (nD) at 25°C ranging from 1.41 to 1.43 and a thixotropic index of 2 or more. This die bonding material is designed to fix a light-emitting element at a predetermined position, ensuring optimal performance. The component (A) is a curable polysilsesquioxane compound that meets specific requirements related to Si-NMR and mass average molecular weight (Mw).
Career Highlights
Throughout her career, Akiko Umeda has worked with notable companies, including Lintec Corporation and Nichia Corporation. Her experience in these organizations has allowed her to refine her skills and contribute to advancements in technology related to light-emitting devices.
Collaborations
Umeda has collaborated with esteemed colleagues such as Manabu Miyawaki and Hidekazu Nakayama. These partnerships have fostered an environment of innovation and have led to the successful development of her patented technologies.
Conclusion
Akiko Umeda's contributions to the field of die bonding materials and light-emitting devices exemplify her dedication to innovation. Her patented work continues to influence the industry and showcases her role as a leading inventor in her field.