The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Apr. 17, 2020
Lintec Corporation, Tokyo, JP;
Nichia Corporation, Tokushima, JP;
Akiko Umeda, Tokyo, JP;
Manabu Miyawaki, Tokyo, JP;
Hidekazu Nakayama, Tokyo, JP;
Hiroki Inoue, Anan, JP;
Toshifumi Imura, Anan, JP;
LINTEC CORPORATION, Tokyo, JP;
NICHIA CORPORATION, Anan, JP;
Abstract
The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related toSi-NMR and mass average molecular weight (Mw)R-D-SiO  (a-1)