Company Filing History:
Years Active: 2003-2015
Title: Akiko Fujii: Innovator in Semiconductor Technology
Introduction
Akiko Fujii is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of semiconductor technology, holding two patents that showcase her innovative spirit and technical expertise.
Latest Patents
Her latest patents include a semiconductor die pick-up apparatus and a method of picking up semiconductor die using the same. This invention provides a semiconductor die pick-up apparatus that includes a stage, a suction opening, a cover that opens and closes the suction opening, and projections and primary holes arranged at the circumferential edge of the suction opening. The apparatus is designed to efficiently pick up semiconductor dies by suctioning a retaining sheet while ensuring the semiconductor die is securely handled. Another notable patent is related to a copper interconnection comprising a copper or copper alloy layer, wherein at least 50% of the crystal grains form twins. This innovation enhances the reliability of copper interconnections while keeping production costs low.
Career Highlights
Throughout her career, Akiko Fujii has worked with notable companies such as NEC Corporation and Shinkawa Ltd. Her experience in these organizations has allowed her to develop and refine her skills in semiconductor technology.
Collaborations
She has collaborated with esteemed colleagues, including Hidekazu Okabayashi and Kazuyoshi Ueno, contributing to advancements in her field.
Conclusion
Akiko Fujii's work in semiconductor technology exemplifies her dedication to innovation and excellence. Her patents reflect her ability to solve complex problems and improve existing technologies.