The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Mar. 15, 2013
Shinkawa Ltd., Tokyo, JP;
Shinkawa Ltd., Tokyo, JP;
Abstract
Provided is a semiconductor die pick-up apparatus including a stage, a suction opening, a cover that opens and closes a suction opening, and projections and primary holes arranged at a circumferential edge of the suction opening and project from a contact surface. When picking up a semiconductor die, in a state in which at least a portion of a contour of the semiconductor die sticks out from the projections toward the outer circumference of the stage, a retaining sheet at the portion sticking out from the primary holes is suctioned, a tip end of the cover is caused to advance upward, the cover is caused to slide while pushing the retaining sheet and the semiconductor die upward to open the suction opening sequentially, the opened suction opening is caused to suction the retaining sheet sequentially to separate the retaining sheet from the semiconductor die.