Tokyo, Japan

Akihito Kawai

USPTO Granted Patents = 14 

Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 126(Granted Patents)


Location History:

  • Ota-ku, JP (2010 - 2013)
  • Tokyo, JP (2006 - 2023)

Company Filing History:


Years Active: 2006-2025

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14 patents (USPTO):Explore Patents

Title: Akihito Kawai: Innovator in Device Wafer Technology

Introduction

Akihito Kawai is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of device wafer technology, holding a total of 14 patents. His innovative approaches have paved the way for advancements in manufacturing processes.

Latest Patents

Among his latest patents is a laminated device wafer forming method. This method includes a laminating step that involves imaging predetermined lines on the peripheral portions of device wafers and adjusting their relative positions. Another notable patent is a method of manufacturing a layered device chip assembly. This method encompasses several steps, including forming grooves in wafers, grinding, and affixing layers to create a cohesive assembly.

Career Highlights

Akihito Kawai is currently employed at Disco Corporation, where he continues to develop cutting-edge technologies. His work has been instrumental in enhancing the efficiency and effectiveness of device wafer manufacturing.

Collaborations

He collaborates with talented coworkers, including Shunsuke Teranishi and Youngsuk Kim, who contribute to the innovative environment at Disco Corporation.

Conclusion

Akihito Kawai's contributions to device wafer technology exemplify his dedication to innovation and excellence in the field. His patents reflect a commitment to advancing manufacturing processes, making him a key figure in the industry.

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