Akihito Kawai

This inventor holds 16 USPTO granted patents and 2 published patent applications. Top assignees: Disco Corporation, Yokohama National University. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akihito Kawai. Retrieved from https://idiyas.com/inventor/akihito-kawai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 (Patent Applications = 2)

% Patents Active = 87.5

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 128(Granted Patents)

Location History:

Ota-ku, JP (2010 - 2013)
Tokyo, JP (2006 - 2023)

Company Filing History:

Yokohama National University

patents

where one patent can have more than one assignee

Years Active: 2006-2026

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12751251 - Method of manufacturing laminated assembly (2026-09-29),

2. 12701942 - Wafer processing apparatus providing cleaning and etching units with separate shrouds and enclosing separate spinner tables (2026-08-04),

3. 12383982 - Laminated device wafer forming method (2025-08-12),

4. 12322655 - Method of manufacturing layered device chip assembly (2025-06-03),

5. 12300545 - Wafer manufacturing method and laminated device chip manufacturing method (2025-05-13),

6. 12198990 - Wafer manufacturing method and laminated device chip manufacturing method (2025-01-14),

7. 11854891 - Wafer manufacturing method and laminated device chip manufacturing method (2023-12-26),

8. 11764115 - Wafer manufacturing method and laminated device chip manufacturing method (2023-09-19),

9. 11764114 - Wafer manufacturing method and laminated device chip manufacturing method (2023-09-19),

10. 11756831 - Wafer manufacturing method and laminated device chip manufacturing method (2023-09-12),

11. 11164802 - Wafer manufacturing method and multilayer device chip manufacturing method (2021-11-02),

12. 10658220 - Device transferring method (2020-05-19),

13. 8389386 - Stacked wafer manufacturing method (2013-03-05),

14. 7687375 - Lamination device manufacturing method (2010-03-30),

15. 7601485 - Exposure method (2009-10-13),

Title: Akihito Kawai: Innovator in Device Wafer Technology

Introduction

Akihito Kawai is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of device wafer technology, holding a total of 16 patents. His innovative approaches have paved the way for advancements in manufacturing processes.

Latest Patents

Among his latest patents is a laminated device wafer forming method. This method includes a laminating step that involves imaging predetermined lines on the peripheral portions of device wafers and adjusting their relative positions. Another notable patent is a method of manufacturing a layered device chip assembly. This method encompasses several steps, including forming grooves in wafers, grinding, and affixing layers to create a cohesive assembly.

Career Highlights

Akihito Kawai is currently employed at Disco Corporation, where he continues to develop cutting-edge technologies. His work has been instrumental in enhancing the efficiency and effectiveness of device wafer manufacturing.

Collaborations

He collaborates with talented coworkers, including Shunsuke Teranishi and Youngsuk Kim, who contribute to the innovative environment at Disco Corporation.

Conclusion

Akihito Kawai's contributions to device wafer technology exemplify his dedication to innovation and excellence in the field. His patents reflect a commitment to advancing manufacturing processes, making him a key figure in the industry.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: